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data shee t high frequenc y smd type antennas for bt/802.11b/g application 2.45 gh z size 5.3 2.0 product specification ? oct 12, 2004 v.4
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 2 www.yageo.com features ? designed for 2.45 ghz ism-band ? simplifies antenna circuitry ? nisn lead-free terminations ? suitable for wave and reflow soldering ? supplied in tape on reel. applications ? telecommunications ? computing (pcs, printers, pdas) ? wireless office data communications including wlan ? consumer electronics (wireless headphones). description this 2.45 ghz ceramic multilayer antenna has been designed to meet the requirements of the bluetooth tm(1) and ieee 802.11b/g wireless communications protocol. it consists of a rectangular block of low-dielectric ceramic material and is fabricated in a water-based non-toxic process. the antenna is capable of providing good connectivity using near 50 ? microstrip directly onto the pc board. notes 1. bluetooth is a trademark owned by telefonieaktiebolaget l m ericsson, sweden. quick reference data description value centre frequency 2.45 ghz 0 type/01type/02 type/03 type/default/04 type/05 type bandwidth 100 mhz gain 4 dbi max. (depends on the special environment) vswr 2.5 max. (depends on the special environment) polarization linear azimuth beam width omni-directional impedance 50 ? power dissipation 1 w operating temperature ? 55 to + 85 c terminations nisn resistance to soldering heat 260 c for 10 seconds
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 3 www.yageo.com mechanical data l w f w f iwa0001 t c c fig.1. component outline. for dimensions see table 1. physical dimensions table 1 antenna dimensions symbol details dimensions (mm) l ? 5.3 0.20 w ? 2.0 0.20 t ? 1.3 0.20 f feed termination 2.0 0.20 c ? 0.4 0.25
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 4 www.yageo.com electrical characteristics description value centre frequency 2.45 ghz 0 type/01type/02 type/03 type/default/04 type/05 type bandwidth 100 mhz gain 4 dbi max. (depends on the special environment) vswr 2.5 max. (depends on the special environment) polarization linear azimuth beam width omni-directional impedance 50 ? power dissipation 1 w operating temperature ? 55 to + 85 c terminations nisn resistance to soldering heat 260 c for 10 s weight 0.05 g/piece physical dimensions table 2 the dimensions of antenna appearance symbol details dimensions (mm) l ? 5.5 0.2 w ? 2.2 0.2 f feed pad 2.2 0.2 c ? 0.5 0.25 l1 ? 4.3 0.5 footprint dimensions w l c c antenna f l 1 iwa0002 fi g .2. recommend dimensions of solder for dimensions see table 2.
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 5 www.yageo.com marker data: 1: swr= 2.5; f= 2.30 ghz 2: swr= 2.5; f= 2.70 ghz marker data: 1: = ? 10 db; f= 2.33 ghz 2: = ? 10 db; f= 2.60 ghz fig.3 the measurements of typical swr and return loss on the special environment . 2.0 2.1 3.0 f (ghz) swr 1.0 2.0 3.0 5.0 7.0 6.0 8.0 9.0 10.0 4.0 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 iwa0004 1 2 2.0 2.1 3.0 f (ghz) (db) 45 40 35 25 15 20 10 5 0 30 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 iwa0005 1 2 pre-tuning reference only,after-tuning performance is depending on customer installation.
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 6 www.yageo.com xy plane yz plane xz plane ? 270 ? 180 ? 90 0 0 0 ? 180 ? 270 ? 90 ? 270 ? 90 ? 180 0 iwa0058 fig.4 the definitions of x-y-z plane and angle for radiation pattern vertical horizontal 0 ? 90 ? 270 ? 180 iwa0006 0 ? 90 ? 270 ? 180 ? 180 0 ? 90 ? 270 0 ? 10 ? 20 ? 30 ? 40 dbi dbi 0 ? 10 ? 20 ? 30 ? 40 dbi 0 ? 10 ? 20 ? 30 ? 40 xy xz yz table 3 max. and avg. antenna gain value of radiation pattern plane xy (dbi) xz(dbi) yz (dbi) vertical pol. (max.) ? 3.8 2.6 ? 1.8 vertical pol. (avg.) ? 8.4 ? 1.6 ? 9.7 horizontal pol. (max.) 4.0 ? 1.9 2.7 horizontal pol. (avg.) ? 2.2 ? 8.4 ? 2.1 total gain (max.) 4.0 2.7 2.7 total gain (avg.) ? 1.9 ? 1.3 ? 1.9 fig.5 radiation pattern measurements for antenna gain value see table 3.
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 7 www.yageo.com ordering information components may be ordered by using either a phycomp?s unique 12nc or the simple 17-digit clear text code (yageo part number) 12nc ordering code e xample : 4311 153 00245 4 3 x x 1 5 3 0 0 2 x x centre frequency tolerance size 5.3 x 2.0 x 1.3 mm 53 packing 11 13 reel: ? 180 mm; 7", blister, 1000 pcs bulk, 1000 pcs material 1 high-frequency material family 43 antenna iwa0008 245 2.45 ghz default 00 at 100 mhz impedance bandwidth 200 2.00 ghz 00type 210 2.10 ghz 01type 230 2.30 ghz 03type 240 2.40 ghz 04type 220 2.20 ghz 02type 250 2.50 ghz 05type yageo part number e xample : can4311153002451k description code family can43 = antenna products packing 11 = 180 mm/7? blister materials 1 = high frequency materials size 53 = 5.3 2.0 1.3 mm tolerance 00 = large than 100 mhz working frequency (1) 245 = 2.45 ghz (default) 200 = 2.0 ghz (00 type) 210 = 2.1 ghz (01 type) 220 = 2.2 ghz (02 type) 230 = 2.3 ghz (03 type) 240 = 2.4 ghz (04 type) 250 = 2.5 ghz (05 type) packing type 1k = 1,000 pcs per reel notes 1. depends on the special environment.
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 8 www.yageo.com tests and requirements table 4 test procedures and requirements iec 384-10/ cecc32 100 clause iec 60068-2 test method test procedure requirements 4.4 mounting the antenna may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive no visible damage 4.5 visual inspection and dimension check any applicable method using 10 magnification in accordance with specification (chip off 4 mm) 4.8 adhesion a force of 3 n applied for 10 s to the line joining the terminations and in a plane parallel to the substrate mounted in accordance with cecc 32 100, paragraph 4.4 no visible damage 4.9 bond strength of plating on end face conditions: bending 0.5 mm at a rate of 1 mm/s; radius jig: 340 mm; 2 mm warp on fr4 board of 90 mm length no visible damage resistance to soldering heat 260 5 c for 10 5 s in a static solder bath the terminations should be well tinned after recovery; central frequency changed to 6% 4.10 20 (tb) resistance to leaching at 260 5 c for 30 1 s in a static solder bath using visual enlargement of 10, dissolution of the terminations should not exceed 10% 4.11 20 (ta) solderability zero hour test, and test after storage (20 to 24 months) in original atmosphere; unmounted chips completely immersed for 2 0.5 s at 235 5 c good tinning ( 75% covered) at terminations
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 9 www.yageo.com iec 60384-10/ cecc32 100 clause iec 60384-2 test method test procedure requirements 4.12 4 (na) rapid change of temperature ? 55 c (30 minutes) to + 85 c (30 minutes); 100 cycles no visual damage; central frequency changed to 6% 4.14 3 (ca) damp heat 500 12 hours at 60 c; 90 to 95% rh no visual damage; 2 hours recovery; central frequency changed to 6% 4.15 endurance 500 12 hours at 85 c no visual damage; 2 hours recovery; central frequency changed to 6%
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 10 www.yageo.com packing tape and reel specifications tape and reel specifications are in accordance with ?iec 60286-3? . basic dimensions are given in fig. 6 and 7, and table 5 and 6. peel-off force peel-off force of the blister tape is in accordance with ?iec 60286-3? ; that is, at a peel-off speed of 300 10 mm/minute, 0.1 n to 1.3 n for 16 mm tape. the peel-off angle should be between 165 and 180 blister tape environmental considerations ? cover tape, carrier tape and reel do not contain environmentally harmful pvc materials. ? because the carrier tape is made of polycarbonate, a homogeneous material (mono-plastic), it is ideally suited for recycling. ? compared to other pvc-free materials polycarbonate shows excellent stiffness and very little deformation with temperature. mbg516 e f w p 2 p 0 d 0 b 0 a 0 d 1 p 1 direction of unreeling k t 0 cover tape t 1 t 2 blister tape specifications fig.6 blister tape cumulative pitch error: 0.2 mm over 10 pitches. cumulative tolerance over 10 holes: 0.2 mm. k 0 : chosen so that the orientati on of the component cannot change. for dimensions see table 5.
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 11 www.yageo.com table 5 dimensions of blister tape; see fig. 6 symbol dimension tolerance unit a 0 nominal clearance; note 1 2.28 0.10 mm b 0 nominal clearance; note 1 5.70 0.10 mm k 0 nominal clearance; note 1 1.58 0.10 mm w 12.0 0.30 mm e 1.75 0.10 mm f 5.50 0.05 mm d 0 1.50 0.10 mm d 1 1.50 0.25 mm p 0 4.0 0.10 mm p 1 4.0 0.10 mm p 2 2.0 0.05 mm t 0.229 0.02 mm note 1. possible product displacement in pocket. 2. p 0 pitch tolerance over any 10 pitches is 0.2 mm.
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 12 www.yageo.com reel specifications n ca w 1 w 2 hbk039 dimensions in mm. for reel dimension see table 6 fig.7 reel. table 6 reel dimensions; see fig.7 tape width (mm) a (mm) c (mm) n (mm) w 1 (mm) w 2 (mm) quantity per reel (pcs) 12 0.3 180 1.0 19 2.0 58 2.0 12.4 2.0 18.4 2.0 1,000
phycomp product specification high frequency smd type antennas for bt/802.11b/g application 2.45 ghz size 5.3 2.0 2004 oct 12 rev.4 13 www.yageo.com revision history revision date change notification description rev.3 2004 july 15 - - updated company logo rev.4 2004 oct 12 - - add more types of central frequency products for customized layout.eliminate standard demo board.

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